Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-09-18
2007-09-18
Tran, Minh-Loan (Department: 2826)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S112000, C438S123000
Reexamination Certificate
active
11123491
ABSTRACT:
A leadless plastic chip carrier is constructed by half etching one or both sides of the package design onto a leadframe strip so as to create unique design features such as power and/or ground ring surrounding the die attach pad, interlocking rivet head construction for the contact pads, and an interlocking pattern for the die attach pad. After wire bonding and molding, a further etching is performed to isolate and expose contact pads. Singulation of individual chip packages from the leadframe strip is then performed by saw singulation or die punching.
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U.S. Appl. No. 10/697,339, Neil McLellan et al., “Process for Fabricating a Leadless Plastic Chip Carrier”, filed Oct. 30, 2003, currently pending.
U.S. Appl. No. 10/353,241, Neil McLellan et al., “Leadless Plastic Chip Carrier with Etch Back Pad Singulation”, filed Jan. 28, 2003, currently pending.
U.S. Appl. No. 10/757,499, Chun Ho Fan et al., Electronic Components such as Thin Array Plastic Packages and Process for Fabricatiing Same, filed Jan. 15, 2004, currently pending.
U.S. Appl. No. 09/802,678, Neil McLellan et al., Leadless Plastic Chip Carrier with Etch Back Pad Singulation, filed Mar. 9, 2001, currently pending.
Fan Chun Ho
Kwan Kin Pui
Lau Wing Him
McLellan Neil
Tsang Kwok Cheung
ASAT Ltd.
Tran Minh-Loan
LandOfFree
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