Leadless plastic chip carrier with etch back pad singulation

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S112000, C438S123000

Reexamination Certificate

active

11123491

ABSTRACT:
A leadless plastic chip carrier is constructed by half etching one or both sides of the package design onto a leadframe strip so as to create unique design features such as power and/or ground ring surrounding the die attach pad, interlocking rivet head construction for the contact pads, and an interlocking pattern for the die attach pad. After wire bonding and molding, a further etching is performed to isolate and expose contact pads. Singulation of individual chip packages from the leadframe strip is then performed by saw singulation or die punching.

REFERENCES:
patent: 4530152 (1985-07-01), Roche et al.
patent: 4685998 (1987-08-01), Quinn et al.
patent: 5066831 (1991-11-01), Spielberger et al.
patent: 5293072 (1994-03-01), Tsuji et al.
patent: 5444301 (1995-08-01), Song et al.
patent: 5457340 (1995-10-01), Templeton, Jr. et al.
patent: 5710695 (1998-01-01), Manteghi
patent: 5777382 (1998-07-01), Abbott et al.
patent: 5900676 (1999-05-01), Kweon et al.
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 6001671 (1999-12-01), Fjelstad
patent: 6057601 (2000-05-01), Lau et al.
patent: 6081029 (2000-06-01), Yamaguchi
patent: 6093584 (2000-07-01), Fjelstad
patent: 6194786 (2001-02-01), Orcutt
patent: 6229200 (2001-05-01), Mclellan et al.
patent: 6238952 (2001-05-01), Lin
patent: 6294100 (2001-09-01), Fan et al.
patent: 6294830 (2001-09-01), Fjelstad
patent: 6306685 (2001-10-01), Liu et al.
patent: 6372539 (2002-04-01), Bayan et al.
patent: 6459163 (2002-10-01), Bai
patent: 6498099 (2002-12-01), Mclellan et al.
patent: 6528877 (2003-03-01), Ernst et al.
patent: 6545347 (2003-04-01), Mclellan
patent: 6585905 (2003-07-01), Fan et al.
patent: 6586677 (2003-07-01), Glenn
patent: 6635957 (2003-10-01), Kwan et al.
patent: 6821821 (2004-11-01), Fjelstad
patent: 6872661 (2005-03-01), Kwan et al.
patent: 2003/0015780 (2003-01-01), Kang et al.
patent: 59-208756 (1984-11-01), None
U.S. Appl. No. 10/697,339, Neil McLellan et al., “Process for Fabricating a Leadless Plastic Chip Carrier”, filed Oct. 30, 2003, currently pending.
U.S. Appl. No. 10/353,241, Neil McLellan et al., “Leadless Plastic Chip Carrier with Etch Back Pad Singulation”, filed Jan. 28, 2003, currently pending.
U.S. Appl. No. 10/757,499, Chun Ho Fan et al., Electronic Components such as Thin Array Plastic Packages and Process for Fabricatiing Same, filed Jan. 15, 2004, currently pending.
U.S. Appl. No. 09/802,678, Neil McLellan et al., Leadless Plastic Chip Carrier with Etch Back Pad Singulation, filed Mar. 9, 2001, currently pending.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Leadless plastic chip carrier with etch back pad singulation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Leadless plastic chip carrier with etch back pad singulation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leadless plastic chip carrier with etch back pad singulation will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3784569

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.