4. Semiconductor device manufacturing: process
  5. Making field effect device having pair of active regions...
  6. Having insulated gate

Winbond Electronics Corp

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Bond pad with pad edge strengthening structure

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Bond-pad with a single anchoring structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

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Combined in-situ high density plasma enhanced chemical vapor dep

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Patent

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Contactless and intelligence-wise code identification chip...

Registers – Records – Conductive
Reexamination Certificate

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Embedded memory control circuit for control of access operations

Static information storage and retrieval – Addressing – Plural blocks or banks
Patent

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Profile ID: LFUS-PAI-P-705266

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