4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Encapsulating

William D. Zahrt, II

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Critical orifice gap setting for grooving fluid dynamic...

Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface... – Defined electrolyte movement or pressure
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Method and apparatus for correlating semiconductor process...

Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Quality evaluation
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Method and apparatus for measuring jitter

Pulse or digital communications – Synchronizers – Synchronization failure prevention
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Mold cap anchoring method for molded flex BGA packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
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Selectable open circuit and anti-fuse element

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated...
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Profile ID: LFUS-PAI-P-2787981

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