4. Electrolysis: processes, compositions used therein, and methods
  5. Electrolytic coating
  6. Coating selected area

Wen-chou Vincent Wang

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Chip and board stress relief interposer

Electrical connectors – Including elastomeric or nonmetallic conductive portion – Adapted to be sandwiched between preformed panel circuit...
Patent

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Controlled impedance interposer substrate and method of making

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
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Controlled impedence interposer substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Device transfer method

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Electron-beam treatment procedure for patterned mask layers

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask
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Profile ID: LFUS-PAI-P-117561

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