Chip and board stress relief interposer

Details Chip and board stress relief interposer Chip and board stress relief interposer

1998-08-07

2000-04-18

Stephan, Steven L.

Electrical connectors

Including elastomeric or nonmetallic conductive portion

Adapted to be sandwiched between preformed panel circuit...

439 66, H01R 458, H01R 909, H01R 100

Patent

active

060508329

ABSTRACT:
An interposer structure permits a differential transverse displacement of contact pads on opposite sides of the interposer to reduce thermal stresses when the interposer is bonded to contact pads of a chip and a substrate with different thermal coefficients of expansion. The effective elasticity of the interposer between top and bottom contact pads of the interposer is facilitated by perforations which define flap-like regions. A flexible trace couples top contact pads to bottom contact pads through a via while permitting substantial transverse relative displacement of the top and bottom contact pads in flap-like regions.

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