4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates
  6. Warping of semiconductor substrate

Weidong Xie

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Controlling warping in integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Controlling warping in integrated circuit devices

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Warping of semiconductor substrate
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Controlling warping in integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-2294799

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