Controlling warping in integrated circuit devices

Details Controlling warping in integrated circuit devices Controlling warping in integrated circuit devices

2011-04-12

2011-04-12

Wagner, Jenny L. (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Warping of semiconductor substrate

C257SE23045

Reexamination Certificate

active

07923347

ABSTRACT:
Techniques for integrated circuit device fabrication are provided. In one aspect, an integrated circuit device comprises a base, at least one die attached to the base, and a counterbalancing layer on at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die. In another aspect, warping of an integrated circuit device comprising at least one die attached to a base is controlled by applying a counterbalancing layer to at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die.

REFERENCES:
patent: 5834848 (1998-11-01), Iwasaki
patent: 6291899 (2001-09-01), Wensel et al.
patent: 7084489 (2006-08-01), Thurgood
patent: 7164200 (2007-01-01), Brennan et al.
patent: 2005/0189616 (2005-09-01), Brennan et al.

Affiliated with

Also associated with

Rating

Controlling warping in integrated circuit devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Controlling warping in integrated circuit devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Controlling warping in integrated circuit devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2701010