4. Special receptacle or package
  5. Holder for a removable electrical component
  6. For a circuit board

Wei-Feng Lin

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Apparatus for reducing an electrical noise inside a ball...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Ball grid array package with heat sink device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Bond pad structure and its method of fabricating

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Bond pad structure and its method of fabricating

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Chip carrier having a specific power join distribution structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Profile ID: LFUS-PAI-P-192283

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