Ball grid array package with heat sink device

Details Ball grid array package with heat sink device Ball grid array package with heat sink device

2007-04-24

2007-04-24

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S718000, C361S719000, C257S707000, C257S720000, C257S706000

Reexamination Certificate

active

10724891

ABSTRACT:
The present invention provides a heat sink device for the package device to improve the heat dissipating efficiency. The heat sink device includes a first heat sink assembly and a second heat sink assembly. The first heat sink assembly has a first heat dissipating structure, a second heat dissipating structure positioned above first the heat dissipating structure, at least two thermal supports on the backside of the first heat sink assembly and a thermal block on the backside of the first heat sink assembly. The second heat sink assembly has a protruding structure and at least the openings. The first heat sink assembly is fixed with the second heat sink assembly to form a heat sink device by the combination of the thermal supports and the openings. The first heat sink assembly and the second heat sink assembly are attached to the integrated circuit device separately by the thermal block and the protruding structure. This heat sink device provides several heat dissipating pathes by the second heat dissipating structure, the thermal supports, the thermal block, and protruding structure. Therefore, the heat dissipation efficiency of the heat sink device is improved.

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