Adhesion enhanced semiconductor die for mold compound packaging

Details Adhesion enhanced semiconductor die for mold compound packaging Adhesion enhanced semiconductor die for mold compound packaging

1997-11-03

2000-05-23

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438127, 438761, 438928, 427 98, H01L 2144, H01L 2148, H01L 2150

Patent

active

060665149

ABSTRACT:
A semiconductor die includes a metal layer deposited thereon for enhancing adhesion between the die and a mold compound package. The metal layer is substantially oxide free. The die is coated with a layer or layers of copper (Cu) and/or palladium (Pd) by electroplating or electroless coating techniques. The metal layer provides a uniform wetting surface for better adhesion of the die with the mold compound during encapsulation. The increased adhesion reduces the delamination potential of the die from the package.

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