Corporate Assignee
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
Corporate Assignee
active
No affiliations
Encapsulated semiconductor die package
Heat dissipation module for a BGA IC
Lead frame structure
Lead frame type semiconductor package
Lead frame with heat slug
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Profile ID: LFUS-PAI-P-2049414