4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Ball or nail head type contact, lead, or bond

W. Eric Boyd

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High speed switching module comprised of stacked layers...

Multiplex communications – Pathfinding or routing – Through a circuit switch
Reexamination Certificate

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Method for creating neo-wafers from singulated integrated...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate

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Method for electrical interconnection of angularly disposed...

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Stackable layers containing ball grid array packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Three-dimensional imaging processing module incorporating...

Optics: measuring and testing – Range or remote distance finding – With photodetection
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Profile ID: LFUS-PAI-P-2883099

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