High speed switching module comprised of stacked layers...

Multiplex communications – Pathfinding or routing – Through a circuit switch

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C370S388000, C370S389000, C257S499000, C257S661000, C257S930000, C340S002600

Reexamination Certificate

active

07440449

ABSTRACT:
A compact multi-stage switching network (100), and a router (510) incorporating such multi-stage switching network, adapted for simultaneously routing a plurality of data packets from a first plurality of input ports (110) to selected ones of a second plurality of output ports (190) comprising: a first stack (140) of IC switching layers (113) that are stacked in physical contact with one another, each IC switching layer containing at least one switching element circuit (142); a second stack (160) of IC switching layers (113) that are stacked in physical contact with one another, each IC switching layer (113) containing at least one switching element circuit (162); and interconnecting circuitry (150) that connects the first stack (140) of IC layers to the second stack (160) of IC layers to form the compact multi-stage switching network. The stacks (140, 160) are preferably mated to one another in a transverse fashion in order to achieve a natural full-mesh connection. Also contemplated are the use of superconducting IC switching circuits (142) and a suitable superconducting cooling housing (730), as permitted by the compact nature of the multi-stage switching network (100), in order to operate at high speed and low power.

REFERENCES:
patent: 5016138 (1991-05-01), Woodman
patent: 5347428 (1994-09-01), Carson et al.
patent: 5424920 (1995-06-01), Miyake
patent: 5432729 (1995-07-01), Carson et al.
patent: 5541914 (1996-07-01), Krishnamoorthy et al.
patent: 5561622 (1996-10-01), Bertin et al.
patent: 5907178 (1999-05-01), Baker et al.
patent: 5963554 (1999-10-01), Song
patent: 6301247 (2001-10-01), Larson et al.
patent: 6427037 (2002-07-01), Okayama
patent: 7072334 (2006-07-01), Li
patent: 7106728 (2006-09-01), Li
patent: 7239012 (2007-07-01), Pepe et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High speed switching module comprised of stacked layers... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High speed switching module comprised of stacked layers..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High speed switching module comprised of stacked layers... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4003954

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.