Vito J. Tuozzolo

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Integrated thermoelectric cooling

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Surface mount chip package having an array of solder ball contac

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Thermoelectric cooling via electrical connections

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
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Profile ID: LFUS-PAI-P-270991

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