Thermoelectric cooling via electrical connections

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor

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Details

357 87, 361386, 361388, H01L 2302

Patent

active

050123254

ABSTRACT:
A thermoelectrically cooled integrated circuit package is provided which includes a thermally conductive dielectric substrate, an input connecting portion and an output connecting portion supported by the dielectric substrate, and an integrated circuit chip including an input terminal and output terminal. The input terminal is electrically connected to the input connecting portion via a first conductive material, and the output terminal is electrically connected to the output connecting portion via a second conductive material. The first conductive material and the second conductive material thermoelectrically cool the integrated circuit chip when a signal passes through the first conductive material and the second conductive material.

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