4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Vincent Hool

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active

Bypass capacitor embedded flip chip package lid and stiffener

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Method of designing a module-based flip chip substrate design

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Post-passivation thick metal pre-routing for flip chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2844792

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