Method of designing a module-based flip chip substrate design

Details Method of designing a module-based flip chip substrate design Method of designing a module-based flip chip substrate design

2007-10-02

2007-10-02

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S612000, C361S777000, C257S786000

Reexamination Certificate

active

10783608

ABSTRACT:
Methods and apparatus are provided for designing the electrical interconnects of a substrate. Modules are used to design sections of the electrical interconnects. Multiple modules may be interconnected to generate the electrical interconnects. The placement of modules and/or the interconnection of the modules may depend on a netlist and/or a separate report. Modules may even be defined by various constraints. Accordingly, a module based design may be implemented for efficiently and effectively producing a standardized electrical interconnect design.

REFERENCES:
patent: 5200580 (1993-04-01), Sienski
patent: 5691568 (1997-11-01), Chou et al.
patent: 5877942 (1999-03-01), Kida et al.
patent: 6225143 (2001-05-01), Rao et al.
patent: 6319752 (2001-11-01), Tain et al.
patent: 6569694 (2003-05-01), Sarma et al.
patent: 2005/0138584 (2005-06-01), Beattie et al.
patent: 2005/0278674 (2005-12-01), Bhatia et al.
Zuken Be First, “Hot-Stage 4.1”, www.zuken.com.
Cadence, “PCB Design Studio, Cadence PCB Design Tools and the Latest Technology at a Breakthrough Price”, 2003 Cadence Design Systems, Inc., www.cadence.com.
Cadence, “PCB Design Expert, High-Speed, Contrraint-Driven PCB Design”, 2003 Cadence Design Systems, Inc., www.cadence.com.
Mentor Graphics, “Destiny RE for Cadence Allegro”, 2003 Mentor Graphics Corporation.

Affiliated with

Also associated with

Rating

Method of designing a module-based flip chip substrate design does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of designing a module-based flip chip substrate design, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of designing a module-based flip chip substrate design will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3882269