4. Semiconductor device manufacturing: process
  5. With measuring or testing
  6. Packaging or treatment of packaged semiconductor

Venkateshwaran Vaiyapuri

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Die support structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Die support structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Die support structure

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Dual LOC semiconductor assembly employing floating lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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MEMS heat pumps for integrated circuit heat dissipation

Refrigeration – Structural installation – With electrical component cooling
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2089320

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