Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-01-18
2005-01-18
Pham, Long (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S107000, C438S108000, C438S110000
Reexamination Certificate
active
06844217
ABSTRACT:
Disclosed is a method of forming a support structure for supporting multiple dies and resulting structure. The support structure has a cavity with an upper die support surface, sidewalls providing the upper die support surface, and a lower die support bottom surface connected with the sidewalls. The support structure can be formed of a plurality of layers. A first semiconductor die is secured on the lower die support surface and a second semiconductor die is secured to the upper die support surface. An aperture can be formed from the structure bottom surface to the cavity to facilitate electrical connections between the first die and electrical contact areas on the support structure. An encapsulating material is formed around the dies, the electrical connections, and the vacant cavity space to form a packaged semiconductor device.
REFERENCES:
patent: 5674785 (1997-10-01), Akram et al.
patent: 5796165 (1998-08-01), Yoshikawa et al.
patent: 5963429 (1999-10-01), Chen
patent: 5973403 (1999-10-01), Wark
patent: 6013948 (2000-01-01), Akram et al.
patent: 6091138 (2000-07-01), Yu et al.
patent: 6157080 (2000-12-01), Tamaki et al.
patent: 6262488 (2001-07-01), Masayuki et al.
patent: 6265771 (2001-07-01), Ference et al.
patent: 6316727 (2001-11-01), Liu
patent: 6365963 (2002-04-01), Shimada
patent: 6407456 (2002-06-01), Ball
patent: 6469376 (2002-10-01), Vaiyapuri
patent: 20010015485 (2001-08-01), Song et al.
patent: 20020074668 (2002-06-01), Hofstee et al.
patent: 20020079567 (2002-06-01), Lo et al.
patent: 0 729 183 (1996-08-01), None
patent: WO 9737374 (1997-10-01), None
“Multi-Chip Module on Laminate, High-performance packaging for today's silicon”,IBM Microelectronics, 1998.
Copy of Search Report from the Austrian Patent Office dated Aug. 15, 2002.
Dickstein , Shapiro, Morin & Oshinsky, LLP
Micro)n Technology, Inc.
Nguyen Dilinh
Pham Long
LandOfFree
Die support structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Die support structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die support structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3411039