4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package

Vasudeva Atluri

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active

C4 joint reliability

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Integrated circuit packages with reduced stress on die and...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Integrated circuit packages with reduced stress on die and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Methods for preparing semiconductor substrates and...

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2924859

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