Methods for preparing semiconductor substrates and...

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S689000

Reexamination Certificate

active

07851365

ABSTRACT:
The invention provides novel methods for preparing semiconductor substrates for the growth of an ultra-thin epitaxial interfacial phase thereon. The invention additionally provides the ultra-thin epitaxial interfacial phase formed on a semiconductor substrate prepared by the methods of the invention. Epitaxiality of the interfacial phase is ensured by maintaining the cleaned semiconductor substrate in a static and inert atmosphere prior to oxidation to form the interfacial phase. Such interfacial phase are useful as capping layers and dielectric layers for semiconductor devices.

REFERENCES:
patent: 4871416 (1989-10-01), Fukuda
patent: 6023082 (2000-02-01), McKee et al.
patent: 6511876 (2003-01-01), Buchanan et al.
patent: 6613677 (2003-09-01), Herbots et al.
patent: 2007/0161494 (2007-07-01), Fukuyama et al.
patent: 02145767 (1990-06-01), None
Bradley, “A New Heteroepitaxial Silicon Dioxide Nanophase on OH-(1X1) Silicon (100) Identified via 3.05 MeV Ion Channeling and the New 3-D Multistring Code,” Ph.D. dissertation, Arizona State University, Tempe, AZ (2006).
J. Shaw, “Heteroepitaxial Oxide Sample Processing”, Ph.D. dissertation, Arizona State University, Tempe, AZ (2006).
Herbots, et al., “The formation or ordered, ultrathin SiO2/Si(100) interfaces grown on (1x1) Si (100),” Materials Science and Engineering, B87, pp. 303-316, (2001).
Shaw, et al., “Atomic displacement free interfaces and atomic registry in SiO2 / (1x1) Si (100),” J. of Appl. Phys., vol. 100, pp. 104109-104133 (2006).
Altulri, et al., “Hydrogen passivation of Si(100) wafers as templates for low temperature (T < 600°C) epitaxy,” Nucl. Instrum. Methods Phys. Res. vol. B118 (1-4), 144-140 (1996).
Feldman, et al., Fundamentals of Surface and Thin Film Analysis, North Holland, New York 1986. pp. 120-123.
Feldman and Picraux, Materials Analysis by ION Channeling, Academic, New York (1982) pp. 159-160.
Leavit, et al., “Cross sections for 170.5° backscattering of 4He from oxygen for 4He energies between 1.8 and 5.0 MeV,” Nucl. Instrum. Methods Phys Res., vol. B44 (3), pp. 260-265 (1990).
Ourmazd, et al., “Si-SiO2 Transformation: Interfacial Structure and Mechanism,” Phys. Rev. Lett., vol. 59, pp. 213-216 (1987).
Munkholm, et al., “Observation of a Distributed Epitaxial Oxide in Thermally Grown SiO2 on Si(001)” Phys. Rev. Lett., vol. 75, p. 4254-4257 (1995).
Wilk, et al., “High-k gate dielectrics: Current status and materials properties considerations,” J. of Appl. Phys., vol. 89 (10): pp. 5243-5275 (2001).
Queeney, K. T., et al. “Infrared spectroscopic analysis of an ordered Si/SiO2 interface,” Applied Physics Letters, vol. 84(4): 493-495 (2004).
Hurst, Q. B., et al. “Long range order in ultra-thin SiO2grown on ordered Si(100),” Symposium, 5-8 (1999) 181-187 ; Ultrathin SiO2 and High-K Materials for ULSI Gate Dielectrics. Symposium.
Herbots, N., et al. “Discovery of long range order in thin (2-20 nm) SiO2films by ion beam analysis,” Defect and Impurity Engineered Semiconductors II. Symposium, 13-17 (1998) 137-142.
Atluri, V., et al. “Comparison and reproducibility of H-passivation of Si(100) with HF in methanol, ethanol, isopropanol and water by IBA, TMAFM, and FTIR Science and Technology of Semiconductor Surface Preparation,” Symposium, 1-3 (1997) 281-292.
Hearne, S., et al., “Jacobsson, H. Characterization of carbon in heteroepitaxial Si1-x-yGexCy thin films via combined ion channeling and nuclear resonance analysis,” Nuclear Instruments & Methods in Physics Research, Section B (Beam Interactions with Materials and Atoms). vol. 118(1-4):88-96 (1996).
Atluri, V., et al., “H-passivation of Si(100) surfaces : Correlation with ion beam characterization (elastic recoil and nuclear resonance) and atomic force microscopy,” Proceedings of Fifth International Symposium. ULSI Science and Technology, 23-26 (1995) 116-128.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods for preparing semiconductor substrates and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for preparing semiconductor substrates and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for preparing semiconductor substrates and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4230432

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.