Vahak K. Sahakian

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Apparatus for isolation of flux materials in "flip-chip" manufac

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Integrated circuit chip sealing assembly

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Method and apparatus for isolation of flux materials in "flip-ch

Metal working – Method of mechanical manufacture – Electrical device making
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Method and apparatus for isolation of flux materials in flip-chi

Metal fusion bonding – Process – Plural joints
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Method and apparatus for isolation of flux materials in flip-chi

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Profile ID: LFUS-PAI-P-121549

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