Metal fusion bonding – Process – Plural joints
Patent
1992-11-24
1994-04-05
Ramsey, Kenneth J.
Metal fusion bonding
Process
Plural joints
228 563, H05K 111
Patent
active
052997308
ABSTRACT:
A preformed planar structure is interposed between the chip(s) and the substrate in a flip-chip structure, and establishes a minimum gap between the chip(s) and the substrate. Liquid flux may be applied to the preformed planar structure in order that flux is selectively applied to the solder balls (pads) on the chip and the substrate. The preformed planar structure may be provided with through holes in registration with the solder balls on the chip(s) and the substrate. In this case, liquid flux selectively fills the through holes for delivery to the solder balls during soldering. The through holes also aid in maintaining registration of the chip(s) and the substrate. The through holes may be sized to establish a predetermined mechanical structure of solder joints formed by the solder balls when fused together. The preformed planar structure has a planar core and opposing planar faces. The core is formed of thermosetting organic resin, such as polyimide, or non-organic material such as alumina, polished sapphire, beryllium oxide, aluminum nitride or aluminum. The planar faces of the preformed planar structure are formed of thermoplastic resin or thermosetting material, such as polyacetal, epoxide resin or polystyrene. The preformed planar structure tends to draw the chip(s) together to the substrate, establishing a flip-chip structure of mechanical integrity. The preformed planar structure has a thickness of 5-50 microns, preferably on the order of 20-30 microns. Method and apparatus are disclosed.
REFERENCES:
patent: 3429040 (1969-02-01), Miller
patent: 3701451 (1972-10-01), Schindler et al.
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 3835531 (1974-09-01), Luttmer
patent: 3871014 (1975-03-01), King et al.
patent: 3984860 (1976-10-01), Logue
patent: 4080512 (1978-03-01), Ramet et al.
patent: 4100566 (1978-07-01), Okikawa et al.
patent: 4120020 (1978-10-01), Uden et al.
patent: 4141030 (1979-02-01), Eisele et al.
patent: 4190855 (1980-02-01), Inoue
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4258381 (1981-03-01), Inaba
patent: 4340902 (1982-07-01), Honda et al.
patent: 4355463 (1982-10-01), Burns
patent: 4396935 (1983-08-01), Schuck
patent: 4408218 (1983-10-01), Grabbe
patent: 4460537 (1984-07-01), Heinle
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4587550 (1986-05-01), Matsuda
patent: 4631805 (1986-12-01), Olsen et al.
patent: 4664309 (1987-05-01), Allen et al.
patent: 4680617 (1987-07-01), Ross
patent: 4688152 (1987-08-01), Chia
patent: 4700276 (1987-10-01), Freyman et al.
patent: 4700473 (1987-10-01), Freyman et al.
patent: 4705917 (1987-11-01), Gates, Jr. et al.
patent: 4717066 (1988-01-01), Goldenberg et al.
patent: 4771330 (1988-09-01), Long
patent: 4772936 (1988-09-01), Reding et al.
patent: 4783722 (1988-11-01), Osaki et al.
patent: 4800419 (1989-01-01), Long et al.
patent: 4803546 (1989-02-01), Sugimoto et al.
patent: 4825284 (1989-04-01), Soga et al.
patent: 4830264 (1989-05-01), Bitaillou et al.
patent: 4868349 (1989-09-01), Chia
patent: 4874722 (1989-10-01), Bednarz et al.
patent: 4890194 (1989-12-01), Derryberry et al.
patent: 4926241 (1990-05-01), Carey
patent: 4933741 (1990-06-01), Schroeder
patent: 4935581 (1990-06-01), Komathu
patent: 4961105 (1990-10-01), Yamamoto
patent: 4965702 (1990-10-01), Lott et al.
patent: 4970575 (1990-11-01), Soga et al.
patent: 4970577 (1990-11-01), Ogihara et al.
patent: 4972253 (1990-11-01), Palino et al.
patent: 4984059 (1991-01-01), Kubota et al.
patent: 4985748 (1991-01-01), Belanger, Jr.
patent: 5006673 (1991-04-01), Freyman et al.
patent: 5006919 (1991-04-01), Disko
patent: 5012386 (1991-04-01), McShane et al.
patent: 5031069 (1991-07-01), Anderson
patent: 5047837 (1991-09-01), Kitano et al.
patent: 5048166 (1991-09-01), Wakamatsu
patent: 5077633 (1991-12-01), Freyman et al.
patent: 5111279 (1992-05-01), Pasch et al.
patent: 5153379 (1992-10-01), Guzuk et al.
patent: 5153385 (1992-10-01), Juskey et al.
patent: 5172303 (1992-12-01), Bernardoni et al.
patent: 5195023 (1993-03-01), Manzione et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5620215 (1986-10-01), Lee
LED Array Modules by New Technology Microbump Bonding Method, Hatada et al., IEEE, vol. 13, No. 3, Sep. 1990.
Overmolded Plastic Pad Array Carriers, Freyman et al., IEEE, pp. 176-182, 1991.
Dell'Oca Conrad J.
Pasch Nicholas F.
Sahakian Vahak K.
Linden Gerald E.
LSI Logic Corporation
Ramsey Kenneth J.
Rostoker Michael D.
LandOfFree
Method and apparatus for isolation of flux materials in flip-chi does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for isolation of flux materials in flip-chi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for isolation of flux materials in flip-chi will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-506539