4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated
  6. With specified encapsulant

United Test and Assembly Center Ltd.

Corporate Assignee

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Details

Corporate Assignee

active

No affiliations

Cavity chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Cavity chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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High density chip scale leadframe package and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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High density chip scale leadframe package and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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High performance chip scale leadframe package with thermal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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