4. Semiconductor device manufacturing: process
  5. Chemical etching
  6. Combined with the removal of material by nonchemical means

Tzu-Jen Chou

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Copper interconnects

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Edge peeling improvement of low-k dielectric materials stack...

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate

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Method to reduce dishing and erosion in a CMP process

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Polymeric particle slurry system and method to reduce...

Compositions – Etching or brightening compositions
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2809241

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