4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified configuration

Tu-Anh Tran

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Inductive device including bond wires

Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil
Reexamination Certificate

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Integrated circuit with test pad structure and method of...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Packaged integrated circuit having wire bonds and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Semiconductor device having a bond pad and method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Semiconductor die edge reconditioning

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
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Profile ID: LFUS-PAI-P-2804459

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