Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2006-03-21
2006-03-21
Loke, Stephen (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S773000, C257S776000, C257S662000, C257S663000, C257S690000, C257S678000, C257S786000
Reexamination Certificate
active
07015585
ABSTRACT:
An integrated circuit is packaged using a package substrate that has a bottom side with a regular array of connection points and a top side with the integrated circuit on it. The package substrate also has vias that are present to provide electrical connection between the top and bottom sides. The vias have a via capture pad that is used to directly receive a wire bond. Thus, the wires from the integrated circuit to the top side directly contact the vias at their capture pads. In such a connection there is then no need for a trace from location where the wire is bonded on the top side to the via. This saves cost. Further this makes the package substrate useful for more than one type of integrated circuit.
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Chopin Sheila F.
Downey Susan H.
Harper Peter R.
Safai Sohrab
Tran Tu-Anh
Clingan, Jr. James L.
Freescale Semiconductor Inc.
Hill Susan C.
Im Junghwa
King Robert L.
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