4. Etching a substrate: processes
  5. Nongaseous phase etching of substrate
  6. Etching inorganic substrate

Toshiko Nakagawa

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Bonding layer for bonding resin on copper surface

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate

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Bonding layer forming solution, method of producing...

Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...
Reexamination Certificate

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Composition for microetching copper or copper alloy

Compositions – Etching or brightening compositions – Inorganic acid containing
Patent

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Composition for treating copper and copper alloy surfaces and me

Coating processes – With post-treatment of coating or coating material – Heating or drying
Patent

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Composition for treating copper or copper alloy surfaces

Compositions – Etching or brightening compositions
Patent

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Profile ID: LFUS-PAI-P-184803

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