Bonding layer for bonding resin on copper surface

Details Bonding layer for bonding resin on copper surface Bonding layer for bonding resin on copper surface

2006-04-18

2006-04-18

Lavilla, Michael E. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S674000, C428S675000, C428S336000, C428S457000

Reexamination Certificate

active

07029761

ABSTRACT:
A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum. The copper is contained in an amount of 1 to 50 atom %, the tin is contained in an amount of 20 to 98 atom %, and the third metal is contained in an amount of 1 to 50 atom %. The bonding layer has a thickness of not less than 0.001 μm and not more than 1 μm. Thus, adhesion between copper and resin can be enhanced.

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