Composition for treating copper or copper alloy surfaces

Details Composition for treating copper or copper alloy surfaces Composition for treating copper or copper alloy surfaces

1995-02-27

1996-07-02

Le, Hoa Van

Compositions

Etching or brightening compositions

252 794, 134 3, 134 41, 1566251, 1566341, 1566541, 1566551, 1566561, C09K 1300

Patent

active

055320945

ABSTRACT:
A method for roughening surfaces of copper or copper alloy to provide an excellent adhesion of a coated or laminated layer thereon, comprising treating said surfaces with an amount and for a time effective to roughen them with an aqueous solution comprising an azole compound, a copper compound dissolvable in the solution, an organic or inorganic acid and a halogen ion.

REFERENCES:
patent: 3933531 (1976-01-01), Sawa et al.
Metal Finishing, vol. 83, No. 1, Jan. 1985, M. Bakszt, "Providing Solderability Retention By Means Of Chemical Inhibitors".

Affiliated with

Also associated with

Rating

Composition for treating copper or copper alloy surfaces does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composition for treating copper or copper alloy surfaces, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composition for treating copper or copper alloy surfaces will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1505401