Composition for microetching copper or copper alloy

Details Composition for microetching copper or copper alloy Composition for microetching copper or copper alloy

1997-03-04

1999-03-23

Utech, Benjamin

Compositions

Etching or brightening compositions

Inorganic acid containing

252 794, C09K 1304, C09K 1308

Patent

active

058854762

ABSTRACT:
A microetching composition for copper or copper alloys comprising, (a) nitric acid or sulfuric acid, or both, (b) ferric nitrate or ferric sulfate, or both, (c) at least one component selected from a group consisting of unsaturated carboxylic acids, salts of unsaturated carboxylic acid, and anhydrides of unsaturated carboxylic acid, and (d) water. The composition can produce a copper or copper alloy surface exhibiting excellent adhesion to resins such as prepregs and resists and superior solderability. The composition is suitable for the manufacture of printed wiring boards with highly integrated fine line patterns.

REFERENCES:
patent: 3520746 (1970-07-01), Johnson et al.
patent: 3736197 (1973-05-01), Messerschmidt et al.
patent: 4383857 (1983-05-01), Steeves et al.
patent: 4964920 (1990-10-01), Jackson et al.
Patent Abstracts of Japan, vol. 12, No. 306 (C-522), Aug. 19, 1988, JP-63-079983, Apr. 9, 1988.
U.S. application No. 09/116,339, filed Jul. 16. 1998.

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