4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Toshiaki Nishibe

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High-frequency variable attenuator having a controllable...

Wave transmission lines and networks – Attenuators
Reexamination Certificate

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Method of manufacturing a semiconductor device with a pair of ra

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Method of manufacturing a semiconductor device with a pair...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Plastic-encapsulated semiconductor device and fabrication...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Semiconductor device having lead terminals bent in J-shape

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1157927

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