Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1998-05-07
2000-12-26
Fahmy, Wael
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
438106, 438111, 438124, 438127, 257666, 257672, 257675, 257678, 257690, 257692, 257734, 257735, 257787, 257788, 257789, H01L 2144, H01L 21495
Patent
active
061658189
ABSTRACT:
A semiconductor device is disclosed wherein a pair of radiating terminals and a plurality of lead terminals are formed from a single lead frame. A hole or holes in each radiating terminal are formed with an equal width and in an equal pitch to those of gaps between the lead terminals, and the opposite sides of each hole of the radiating terminal are connected to each other by a support element. The support elements of the radiating terminals and support elements which interconnect the lead terminals are formed with an equal length and in an equal pitch to allow the support elements to be cut away by a plurality of punches which are arranged in an equal pitch and have an equal width.
REFERENCES:
patent: 3413713 (1968-12-01), Helda et al.
patent: 3967366 (1976-07-01), Birglechner et al.
patent: 5200806 (1993-04-01), Sawaya
patent: 5612853 (1997-03-01), Kim et al.
patent: 5877937 (1999-03-01), Shibata et al.
Ichikawa Seiji
Kitakoga Toru
Miya Tatsuya
Nishibe Toshiaki
Nishimura Yoshikazu
Fahmy Wael
Kebede Brook
NEC Corporation
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