Semiconductor device having lead terminals bent in J-shape

Details Semiconductor device having lead terminals bent in J-shape Semiconductor device having lead terminals bent in J-shape

1998-04-13

2000-08-15

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257692, 257696, 257712, 257787, H01L 2348

Patent

active

06104086&

ABSTRACT:
A semiconductor device having lead terminals bent in a J-shape is disclosed. A radiating plate having a recess formed on an outer peripheral portion thereof is exposed to a lower face of a resin member and free ends of outer portions of the lead terminals are positioned in the recess of the radiating plate. The free ends of the outer portions of the lead terminals and the recess of the radiating plate are isolated from each other by projections of the resin member. Since the radiating plate is exposed to the lower face of the resin member, the heat radiating property is high whereas the radiating plate and the lead terminals are not short-circuited to each other at all.

REFERENCES:
patent: 3930114 (1975-12-01), Hodge
patent: 4698660 (1987-10-01), Kubota et al.

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