Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
Inventor
active
Copper die bumps with electromigration cap and plated solder
Forming a barrier layer in interconnect joints and...
Methods to deposit metal alloy barrier layers
Preparation of electroless deposition solutions
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Profile ID: LFUS-PAI-P-2196020