4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Wire contact, lead, or bond

Ting-Chen Hsu

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Process for fabricating a non-silicided region in an integrated

Fishing – trapping – and vermin destroying
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Process for forming a semiconductor device having a bond pad

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Semiconductor device having a bond pad

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Patent

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Profile ID: LFUS-PAI-P-908520

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