Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-09-09
1996-02-13
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
H05K 720
Patent
active
054916100
ABSTRACT:
An electronic package having an active cooling system for maintaining a semiconductor chip at approximately a constant temperature by monitoring the present temperature of the chip and varying the air flow over a heat sink in thermal contact with the chip in response to the temperature. In addition, the temperature difference between the semiconductor chip module and a printed circuit board is also monitored to maintain that difference at a preset value. The air flow is varied by a variable speed fan or a variable direction baffle.
REFERENCES:
patent: 5285347 (1994-02-01), Fox et al.
Mok Lawrence S.-W.
Purushothaman Sampath
Sammakia Bahgat G.
Wilczynski Janusz S.
Wu Tien Y.
International Business Machines - Corporation
Thompson Gregory D.
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