Laminated electronic package including a power/ground assembly

Details Laminated electronic package including a power/ground assembly Laminated electronic package including a power/ground assembly

1995-05-11

1996-11-12

Sparks, Donald A.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174255, 174256, 174257, 174258, 174260, 361794, 361795, H05K 714

Patent

active

055746306

ABSTRACT:
A power/ground structure and associated circuit card or board are provided in which the coefficient of thermal expansion of the power/ground structure and associated circuit board are closely matched to each other. The circuit board or card is formed of organic electrically-insulating material having electrical circuitry thereon which carries an integrated circuit chip. The power/ground assembly is formed of alternating layers of organic insulating material and at least two layers of electrically-conducting material, typically copper, one of the layers of electrically-conducting material forming a power connection and another layer of the electrically-conducting material forming a ground plane. There is also at least one additional layer of a structural material having a relatively high Young's Modulus and a CTE of less than about 10 PPM/.degree.C. Invar or copper clad Invar are preferred materials for this structure. The electrically-conducting copper material and the Invar are selected in thickness and number such that, together with the electrically-insulating material, the composite CTE of the power/ground structure closely matches that of the circuit card or board.

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IBM Technical Disclosure Bulletin "Control Of Thermal Coefficient Of Expansion Of Substrate Materials" by Dougherty vol. 19 No. 8 Jan. 1977.

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