4. Coating processes
  5. Immersion or partial immersion
  6. Metal base

Tien-Jen Cheng

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BLM structure for application to copper pad

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Common ball-limiting metallurgy for I/O sites

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Corrosion-resistant terminal metal pads for thin film packages

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate

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Fuse structure and method to form the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate

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Fuse structure and method to form the same

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1127406

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