4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Thomas J. Mozdzen

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Interleaving a bondwire between two bondwires coupled to a same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Patent

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Interleaving a bondwire between two bondwires coupled to a...

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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JTAG boundary scan cell with enhanced testability feature

Error detection/correction and fault detection/recovery – Pulse or data error handling – Digital logic testing
Reexamination Certificate

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Method and apparatus for a microprocessor to enter and exit a re

Patent

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Method and apparatus for capturing data from a non-source...

Electrical computers and digital processing systems: support – Synchronization of clock or timing signals – data – or pulses – Using delay
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1114509

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