Interleaving a bondwire between two bondwires coupled to a same

Details Interleaving a bondwire between two bondwires coupled to a same Interleaving a bondwire between two bondwires coupled to a same

1997-12-24

2000-04-18

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

257780, 257774, 257786, H01L 2348, H01L 2352, H01L 2940

Patent

active

060518901

ABSTRACT:
An integrated circuit device package. A substrate includes a first terminal coupled to the substrate. First and second conductive traces are formed on the substrate and are electrically coupled to the first terminal wherein the first conductive trace is provided to electrically couple a first bondwire to the first terminal and the second conductive trace is provided to electrically couple the second bondwire to the first terminal.

REFERENCES:
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5490324 (1996-02-01), Newman
patent: 5640048 (1997-06-01), Selna
patent: 5798571 (1998-08-01), Nakajima

Affiliated with

Also associated with

Rating

Interleaving a bondwire between two bondwires coupled to a same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interleaving a bondwire between two bondwires coupled to a same , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interleaving a bondwire between two bondwires coupled to a same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2338253