4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Incorporating resilient component

Thomas Distefano

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Fixtures and methods for lead bonding and deformation

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component
Patent

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Fixtures and methods for lead bonding and deformation

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component
Patent

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Methods and apparatus for optically measuring fluid...

Measuring and testing – Borehole or drilling – Fluid flow measuring or fluid analysis
Reexamination Certificate

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Methods of making microelectronic assemblies including...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Methods of making microelectronic assemblies including...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-635102

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