Methods of making microelectronic assemblies including...

Details Methods of making microelectronic assemblies including... Methods of making microelectronic assemblies including...

2005-03-22

2005-03-22

Zarneke, David A. (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

Reexamination Certificate

active

06870272

ABSTRACT:
An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

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