Fixtures and methods for lead bonding and deformation

Details Fixtures and methods for lead bonding and deformation Fixtures and methods for lead bonding and deformation

1996-07-31

1999-06-15

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Incorporating resilient component

438113, H01L 2144

Patent

active

059131098

ABSTRACT:
In a method for mounting a sheet-like multi-layer element for producing a microelectronic component, the sheet-like element is first bonded to an expansion ring. The expansion ring is then heated to stretch the sheet-like element. A frame ring, having an external diameter smaller than the internal diameter of the expansion ring, is then bonded to the sheet-like element. The assembly is then cooled, and the expansion ring is cut away. In another embodiment, a method is provided for bonding bond pads on a sheet-like microelectronic element to terminal pads on a microelectronic component. The microelectronic element is first placed on a rigid plate and the sheet-like element, which has been bonded to a frame ring, is placed over the microelectronic component. A disk is then placed on the sheet-like element, and force is applied to the disk, bringing the bond pads on the sheet-like element into contact with the terminal pads on the microelectronic element. Heat is then applied, forming the bonds.

REFERENCES:
patent: Re35119 (1995-12-01), Blonder et al.
patent: 3373481 (1968-03-01), Lins et al.
patent: 3795037 (1974-03-01), Luttmer
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 3825353 (1974-07-01), Loro
patent: 3842189 (1974-10-01), Southgate
patent: 3952404 (1976-04-01), Matunami
patent: 4067104 (1978-01-01), Tracy
patent: 4142288 (1979-03-01), Flammer et al.
patent: 4326663 (1982-04-01), Oettel
patent: 4447857 (1984-05-01), Marks et al.
patent: 4520562 (1985-06-01), Sade et al.
patent: 4629957 (1986-12-01), Walteis et al.
patent: 4661192 (1987-04-01), McShaen
patent: 4667219 (1987-05-01), Lee et al.
patent: 4721995 (1988-01-01), Tanizawa
patent: 4751199 (1988-06-01), Phy
patent: 4785137 (1988-11-01), Samuels
patent: 4793814 (1988-12-01), Zifcak et al.
patent: 4812191 (1989-03-01), Ho et al.
patent: 4893172 (1990-01-01), Matsummoto et al.
patent: 4926241 (1990-05-01), Carey
patent: 4937653 (1990-06-01), Blonder et al.
patent: 4949158 (1990-08-01), Ueda
patent: 4954877 (1990-09-01), Nakanishi et al.
patent: 4955523 (1990-09-01), Calomagno et al.
patent: 5047830 (1991-09-01), Grabbe
patent: 5049085 (1991-09-01), Reylek et al.
patent: 5055907 (1991-10-01), Jacobs
patent: 5057460 (1991-10-01), Rose
patent: 5067007 (1991-11-01), Kanji et al.
patent: 5086337 (1992-02-01), Noro et al.
patent: 5131852 (1992-07-01), Grabbe et al.
patent: 5152695 (1992-10-01), Grabbe et al.
patent: 5166099 (1992-11-01), Ueda et al.
patent: 5173055 (1992-12-01), Grabbe
patent: 5192716 (1993-03-01), Jacobs
patent: 5197892 (1993-03-01), Yoshizawa et al.
patent: 5210939 (1993-05-01), Mallik et al.
patent: 5230931 (1993-07-01), Yamazaki et al.
patent: 5254811 (1993-10-01), Ludden et al.
patent: 5286680 (1994-02-01), Cain
patent: 5346861 (1994-09-01), Khandros et al.
patent: 5455390 (1995-10-01), DiStefano et al.
patent: 5528083 (1996-06-01), Malladi et al.
Research Disclosure No. 322 (Feb. 1991) "Method of Testing Chips and Joining Chips to Substrates," XP 000169195.
"Method of Testing Chips and Joining Chips to Substrates", Research Disclosure, Feb. 1991, No. 322, Kenneth Mason Publication Ltd., England.
IBM Technical Disclosure Bulletin, vol. 36, No. 07, Jul. 1993.

Affiliated with

Also associated with

Rating

Fixtures and methods for lead bonding and deformation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fixtures and methods for lead bonding and deformation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fixtures and methods for lead bonding and deformation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-409808