4. Sewing
  5. Elements
  6. Presser devices

Tetsuya Tsumura

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Heat dissipating wiring board and method for manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Method of manufacturing heat conductive substrate

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Spring biased presser foot

Sewing – Elements – Presser devices
Patent

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Thermal processing apparatus for a band film

Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-831385

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