Method of manufacturing heat conductive substrate

Details Method of manufacturing heat conductive substrate Method of manufacturing heat conductive substrate

2007-10-09

2007-10-09

Wilczewski, Mary (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S107000

Reexamination Certificate

active

10488547

ABSTRACT:
The present invention offers a method of manufacturing a heat conductive substrate, with which substrate contamination on the surface of lead frame due to oozing or push out of thermosetting resin composite during heat-pressurization is suppressed. The oozing or push out of thermosetting resin composite from the through hole of lead frame can be prevented by a film attached on the components mounting surface of lead frame.

REFERENCES:
patent: 6570099 (2003-05-01), Hirano et al.
patent: 2003/0175465 (2003-09-01), Watanabe et al.
patent: 11312750 (1999-11-01), None
patent: 2001-203313 (2001-07-01), None
patent: 2001-210764 (2001-08-01), None
patent: 2001-251037 (2001-09-01), None
patent: 2002-33558 (2002-01-01), None
patent: 2002-359315 (2002-12-01), None

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