Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
1998-08-25
2001-10-02
Jeffery, John A. (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C219S243000
Reexamination Certificate
active
06297478
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a thermal processing apparatus for a band film, preferably used for embossing a carrier tape accommodating chip components.
In general, a thermal processing of a band film comprises a preheating of a portion of the band film by a heating unit and a succeeding embossing of the heated portion into a predetermined pattern by an embossing unit. The same pattern is continuously formed on the surface of the band film by repetitively applying the heating and the embossing on the band film advancing with a predetermined pitch.
In such a thermal processing apparatus repeating the same sequential operations, a higher productivity is realized by reducing the time required for accomplishing one cycle of the thermal processing. To this end, it is desirable to locate the heating unit adjacent to the embossing unit.
As the band film advances with the same pitch and the same timing when the thermal processing is continuously performed, the temperature of the next processed surface of the band film is stably increased to substantially the same value.
However, a problem arises when the thermal processing is interrupted or stopped because a portion of the band film located immediately before the embossing unit is subjected to high temperature of the heating unit for a long time. This will excessively increase the temperature of the first processed portion of the band film in the resumed thermal processing.
Furthermore, the heat radiated from the heating unit will possibly deform or shrink a finished embossed portion of the band film staying at the embossing unit located adjacent to the heating unit during a dormant period of the thermal processing apparatus.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a thermal processing apparatus for a band film capable of stabilizing the heating of a band film and improving the quality of the embossing applied on a heated surface of the band film.
In order to accomplish the above and other related objects, one aspect of the present invention provides a thermal processing apparatus comprising a heating unit including a pair of heating bodies for heating a band film conveyed along a predetermined film feeding path defined by a film guide, an embossing unit including a punch and a die for forming a predetermined raised pattern on a heated surface of the band film, and a shifting mechanism for locating the heating unit and the embossing unit closely by a first distance during a thermal processing of the band film and for separating at least one of the heating unit and the band film far away from the other by a second distance larger than the first distance when the thermal processing is interrupted or stopped.
Preferably, the second distance between the heating unit and the embossing unit separated by the shifting mechanism is equivalent to 0.8 to 2.0 times a width of the band film.
Another aspect of the present invention provides a thermal processing apparatus comprising a heating unit including a pair of heating bodies each accommodating a heater, a first shifting mechanism for locating the heating bodies to a first position where the heating bodies are positioned closely to both surfaces of a band film conveyed along a predetermined film feeding path defined by a film guide, an embossing unit including a punch and a die disposed adjacent to the heating bodies located at the first position for forming a predetermined raised pattern on a heated surface of the band film, and a second shifting mechanism for locating the heating bodies to a second position where the heating bodies are kept far away from the band film.
Preferably, the second shifting mechanism shifts the heating bodies to the second position when a thermal processing of the band film is interrupted or stopped. The second shifting mechanism shifts the heating bodies in a direction different from the film feeding path. A preferable shifting direction of the heating bodies by the second shifting mechanism is normal to the film feeding path. Moreover, the second shifting mechanism may comprise a transfer frame mounting the heating bodies. The second shifting mechanism may include an air cylinder shifting the transfer frame. An optimum result is obtained when the second shifting mechanism keeps the heating bodies far away from the band film by a distance equivalent to 0.8 to 2.0 times a width of the band film. The first shifting mechanism may comprise a cam and a cam follower.
Another aspect of the present invention provides a thermal processing apparatus comprising a heating unit including a pair of heating bodies positioned closely to both surfaces of a band film conveyed along a predetermined film feeding path defined by a film guide, an embossing unit including a punch and a die for forming a predetermined raised pattern on a heated surface of the band film, and a shifting mechanism for selectively locating the band film to a first position where the band film is positioned closely to the heating bodies and a second position where the band film is kept far away from the heating bodies.
Preferably, the shifting mechanism moves the film guide for shifting the band film between the first position and the second position. The shifting mechanism moves the embossing unit together with the film guide. The shifting mechanism shifts the film guide in a direction different from the film feeding path. A preferable shifting direction of the film guide by the shifting mechanism is normal to the film feeding path. The shifting mechanism may comprise a transfer frame mounting the film guide. The shifting mechanism may include an air cylinder shifting the transfer frame. An optimum result is obtained when the shifting mechanism keeps the film guide far away from the heating bodies by a distance equivalent to 0.8 to 2.0 times a width of the band film.
Another aspect of the present invention provides a thermal processing apparatus comprising a heating unit including a pair of heating bodies each accommodating a heater, a first shifting mechanism for locating the heating bodies to a first position where the heating bodies are positioned closely to both surfaces of a band film conveyed along a predetermined film feeding path defined by a film guide, an embossing unit including a punch and a die disposed adjacent to the heating bodies located at the first position for forming a predetermined raised pattern on a heated surface of the band film, and a second shifting mechanism for locating the heating bodies to a second position where the heating bodies are kept far away from the embossing unit.
Preferably, the second shifting mechanism shifts the heating bodies to the second position when a thermal processing of the band film is interrupted or stopped. The second shifting mechanism shifts the heating bodies in a direction parallel to the film feeding path. The second shifting mechanism may comprise a transfer frame mounting the heating bodies. The second shifting mechanism may include an air cylinder shifting the transfer frame. The first shifting mechanism may comprise a cam and a cam follower.
Another aspect of the present invention provides a thermal processing apparatus comprising a heating unit including a pair of heating bodies for heating a band film conveyed along a predetermined film feeding path defined by a film guide, an embossing unit including a punch and a die for forming a predetermined raised pattern on a heated surface of the band film, and a shifting mechanism for selectively locating the heating bodies to a first position where the heating bodies are positioned closely to the band film and a second position where the heating bodies are kept far away from the band film.
Preferably, the shifting mechanism shifts the heating bodies in a direction different from the film feeding path. A preferable shifting direction of the heating bodies by the shifting mechanism is normal to the film feeding path. The shifting mechanism may comprise a pair of actuators shifting the heating bodies independently.
REFERENCES:
patent
Hino Kiyoshi
Kano Yoshinobu
Miyazaki Osamu
Murakami Kazuhiro
Tsumura Tetsuya
Connolly Bove Lodge & Hutz
Jeffery John A.
Matsushita Electric - Industrial Co., Ltd.
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