Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
Inventor
active
Integrated circuit device with covalently bonded connection...
Method and apparatus for improving an integrated circuit device
Surface treatment for microelectronic device substrate
Wafer-level underfill process making use of sacrificial...
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Profile ID: LFUS-PAI-P-2607125