Method and apparatus for improving an integrated circuit device

Details Method and apparatus for improving an integrated circuit device Method and apparatus for improving an integrated circuit device

2006-02-21

2006-02-21

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S246000

Reexamination Certificate

active

07000821

ABSTRACT:
A method and apparatus provides increased operative life for flip-chip devices that are produced from an integrated circuit formed with electrically conductive bumps bonded to a printed circuit board substrate. The bumps and the substrate are formed from similar materials that allow control of the degree of latency for each element and produce a covalently bonded laminate structure when the bumps and substrate are brought together. The covalently bonded structure decreases bump fatigue to lengthen the operative life of the flip-chip device.

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