Wafer-level underfill process making use of sacrificial...

Details Wafer-level underfill process making use of sacrificial... Wafer-level underfill process making use of sacrificial...

2006-06-13

2006-06-13

Chang, Rick K. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S830000, C029S843000, C029S739000, C029S740000, C029S840000, C174S050510, C361S760000, C439S066000, C439S068000, C439S072000, C439S074000, C439S075000

Reexamination Certificate

active

07059048

ABSTRACT:
A method for connecting electronic components, such as, an integrated circuit die and a package substrate, is described. According to one aspect of the invention, a contact pad protective material is applied on one or more of the contact pads on an integrated circuit die. The underfill material is applied to the surface of the die not covered by the contact pad protective material and the underfill material is partially cured in a curing oven. The contact pad material is removed leaving openings over the respective surface of the contact pad. A one or more contacts on a package substrate is inserted into the openings, electronically connecting the contacts to the contact pads.

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